CYF1018V18L-100BGXI
512K X 36 MULTI DEVICE FIFO MODULE, 10 ns, PBGA209

From Cypress Semiconductor Corp.

StatusACTIVE
Access Time-Max (tACC)10 ns
Cycle Time41.67 ns
Memory Density1.89E7 deg
Memory IC TypeMULTI DEVICE FIFO MODULE
Memory Width36
Mfr Package Description14 X 22 MM, 1.76 MM HEIGHT, FBGA-209
Number of Functions1
Number of Terminals209
Number of Words524288 words
Number of Words Code512K
Operating ModeSYNCHRONOUS
Operating Temperature-Max85 Cel
Operating Temperature-Min-40 Cel
Organization512K X 36
Output EnableYes
Package Body MaterialPLASTIC/EPOXY
Package ShapeRECTANGULAR
Package StyleGRID ARRAY
Supply Voltage-Max (Vsup)1.58 V
Supply Voltage-Min (Vsup)1.42 V
Supply Voltage-Nom (Vsup)1.5 V
Surface MountYes
TechnologyCMOS
Temperature GradeINDUSTRIAL
Terminal FormBALL
Terminal Pitch1 mm
Terminal PositionBOTTOM

External links