CYF1072V18L-100BGXI 2M X 36 MULTI DEVICE FIFO MODULE, 10 ns, PBGA209
From Cypress Semiconductor Corp.
| Status | ACTIVE |
| Access Time-Max (tACC) | 10 ns |
| Cycle Time | 41.67 ns |
| Memory Density | 7.55E7 deg |
| Memory IC Type | MULTI DEVICE FIFO MODULE |
| Memory Width | 36 |
| Mfr Package Description | 14 X 22 MM, 1.76 MM HEIGHT, FBGA-209 |
| Number of Functions | 1 |
| Number of Terminals | 209 |
| Number of Words | 2.10E6 words |
| Number of Words Code | 2M |
| Operating Mode | SYNCHRONOUS |
| Operating Temperature-Max | 85 Cel |
| Operating Temperature-Min | -40 Cel |
| Organization | 2M X 36 |
| Output Enable | Yes |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY |
| Supply Voltage-Max (Vsup) | 1.58 V |
| Supply Voltage-Min (Vsup) | 1.42 V |
| Supply Voltage-Nom (Vsup) | 1.5 V |
| Surface Mount | Yes |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | BALL |
| Terminal Pitch | 1 mm |
| Terminal Position | BOTTOM |
