CYF2036V18L-100BGXI MULTI DEVICE FIFO MODULE, PBGA209
From Cypress Semiconductor Corp.
Status | ACTIVE |
Memory IC Type | MULTI DEVICE FIFO MODULE |
Mfr Package Description | 14 X 22 MM, 1.76 MM HEIGHT, FBGA-209 |
Number of Terminals | 209 |
Package Body Material | PLASTIC/EPOXY |
Package Shape | RECTANGULAR |
Package Style | GRID ARRAY |
Surface Mount | Yes |
Terminal Form | BALL |
Terminal Position | BOTTOM |