- WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC1G11YZPR _ _ _C3_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC1G11DBVR C11_ QFN - DRY Reel of 5000 SN74LVC1G11DRYR C3 QFN - DSF Reel of 5000 SN74LVC1G11DSFR C3 SOT (SC-70) - DCK Reel of 3000 SN74LVC1G11DCKR C3_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). Table 1. FUNCTION TABLE INPUTS A B C OUTPUT Y H H H H L X X L X L X L X X L L LOGIC DIAGRAM (POSITIVE LOGIC) A B C Y Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage
GE (1) TA -40C to 85C (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC1G11YZPR _ _ _C3_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC1G11DBVR C11_ SOT (SC-70) - DCK Reel of 3000 SN74LVC1G11DCKR C3_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a t
GE (1) TA -40C to 85C (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC1G11YZPR _ _ _C3_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC1G11DBVR C11_ SOT (SC-70) - DCK Reel of 3000 SN74LVC1G11DCKR C3_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a t
5C (1) (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) ORDERABLE PART NUMBER Tape and reel TOP-SIDE MARKING (2) SN74LVC1G11YEPR _ _ _C3_ SN74LVC1G11YZPR SOT (SOT-23) - DBV Tape and reel SN74LVC1G11DBVR C11_ SOT (SC-70) - DCK Tape and reel SN74LVC1G11DCKR C3_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar, N
- WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC1G11YZPR _ _ _C3_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC1G11DBVR C11_ QFN - DRY Reel of 5000 SN74LVC1G11DRYR C3 QFN - DSF Reel of 5000 SN74LVC1G11DSFR C3 SOT (SC-70) - DCK Reel of 3000 SN74LVC1G11DCKR C3_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). Table 1. FUNCTION TABLE INPUTS A B C OUTPUT Y H H H H L X X L X L X L X X L L LOGIC DIAGRAM (POSITIVE LOGIC) A B C Y Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage
GE (1) TA -40C to 85C (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC1G11YZPR _ _ _C3_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC1G11DBVR C11_ SOT (SC-70) - DCK Reel of 3000 SN74LVC1G11DCKR C3_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a t
GE (1) TA -40C to 85C (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC1G11YZPR _ _ _C3_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC1G11DBVR C11_ SOT (SC-70) - DCK Reel of 3000 SN74LVC1G11DCKR C3_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a t
GE (1) TA -40C to 85C (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC1G11YZPR _ _ _C3_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC1G11DBVR C11_ SOT (SC-70) - DCK Reel of 3000 SN74LVC1G11DCKR C3_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a t
to 125 (C115, C11F, C11K, C11R) SN74LVC1G11DBVRE4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C11F SN74LVC1G11DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C11F SN74LVC1G11DCKR ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (C35, C3F, C3K, C3 R) SN74LVC1G11DCKRE4 ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (C35, C3F, C3K, C3 R) SN74LVC1G11DCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (C35, C3F, C3K, C3 R) SN74LVC1G11DRYR ACTIVE SON DRY 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C3 SN74LVC1G11DSFR ACTIVE SON DSF 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C3 SN74LVC1G11YZPR ACTIVE DSBGA YZP 6 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 C3N (1) The marketing status values are
5C (1) (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) ORDERABLE PART NUMBER Tape and reel TOP-SIDE MARKING (2) SN74LVC1G11YEPR _ _ _C3_ SN74LVC1G11YZPR SOT (SOT-23) - DBV Tape and reel SN74LVC1G11DBVR C11_ SOT (SC-70) - DCK Tape and reel SN74LVC1G11DCKR C3_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar, N
GE (1) TA -40C to 85C (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC1G11YZPR _ _ _C3_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC1G11DBVR C11_ SOT (SC-70) - DCK Reel of 3000 SN74LVC1G11DCKR C3_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a t
GE (1) TA -40C to 85C (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC1G11YZPR _ _ _C3_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC1G11DBVR C11_ SOT (SC-70) - DCK Reel of 3000 SN74LVC1G11DCKR C3_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a t
GE (1) TA -40C to 85C (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC1G11YZPR _ _ _C3_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC1G11DBVR C11_ SOT (SC-70) - DCK Reel of 3000 SN74LVC1G11DCKR C3_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a t
GE (1) TA -40C to 85C (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC1G11YZPR _ _ _C3_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC1G11DBVR C11_ SOT (SC-70) - DCK Reel of 3000 SN74LVC1G11DCKR C3_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a t
GE (1) TA -40C to 85C (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC1G11YZPR _ _ _C3_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC1G11DBVR C11_ SOT (SC-70) - DCK Reel of 3000 SN74LVC1G11DCKR C3_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a t