SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC1G17DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC1G17DCKRE4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC1G17DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC1G17DCKT ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC1G17DCKTE4 ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC1G17DRLR ACTIVE SOP DRL 5 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC1G17DRLRG4 ACTIVE SOP DRL 5 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC1G17YEAR ACTIVE WCSP YEA 5 3000 TBD SNPB Level-1-260C-UNLIM SN74LVC1G17YEPR ACTIVE WCSP YEP 5 3000 TBD SNPB Level-1-260C-UNLIM SN74LVC1G17YZAR ACTIVE WCSP YZA 5 3000 Pb-Free (RoHS) SNAGCU Level-1-260C-UNLIM SN74LVC1G17YZPR ACTIVE WCSP YZP 5 3000 Pb-Free (RoHS) SNAGCU Level-1-260C-UNLIM
1G17DSFR C7 C7 SN74LVC1G17DBV3 Reel of 3000 SOT (SOT-23) - DBV SN74LVC1G17DBVR SN74LVC1G17DBVRE4 SN74LVC1G17DBVRG4 -40C to 85C Tube of 250 C17 SN74LVC1G17DBVT SN74LVC1G17DBVTE4 SN74LVC1G17DCK3 Reel of 3000 SOT (SC-70) - DCK (1) (2) (3) 2 SN74LVC1G17DCKRE4 SN74LVC1G17DCKRG4 Tube of 250 SOT (SOT-553) - DRL SN74LVC1G17DCKR Reel of 4000 C7_ SN74LVC1G17DCKT SN74LVC1G17DCKTE4 SN74LVC1G17DRLR SN74LVC1G17DRLRG4 C7_ Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, *
RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 (C75, C7F, C7K, C7 R, C7T) (C7H, C7P, C7S) SN74LVC1G17DCKRE4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (C75, C7F, C7K, C7 R, C7T) (C7H, C7P, C7S) SN74LVC1G17DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (C75, C7F, C7K, C7 R, C7T) (C7H, C7P, C7S) SN74LVC1G17DCKT ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 (C75, C7F, C7K, C7 R, C7T) (C7H, C7P, C7S) SN74LVC1G17DCKTE4 ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (C75, C7F, C7K, C7 R, C7T) (C7H, C7P, C7S) SN74LVC1G17DCKTG4 ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (C75, C7F, C7K, C7 R, C7T) (C7H, C7P, C7S) SN74LVC1G17DPWR ACTIVE X2SON DPW 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 S4 Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.t
SN74LVC1G17DBV3 Reel of 3000 SOT (SOT-23) - DBV SN74LVC1G17DBVR SN74LVC1G17DBVRE4 SN74LVC1G17DBVRG4 -40C to 85C Tube of 250 C17 SN74LVC1G17DBVT SN74LVC1G17DBVTE4 SN74LVC1G17DCK3 Reel of 3000 SOT (SC-70) - DCK SOT (SOT-553) - DRL (2) (3) SN74LVC1G17DCKRE4 SN74LVC1G17DCKRG4 Tube of 250 (1) SN74LVC1G17DCKR Reel of 4000 SN74LVC1G17DCKT SN74LVC1G17DCKTE4 SN74LVC1G17DRLR SN74LVC1G17DRLRG4 C7_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates sol
1G17DSFR C7 C7 SN74LVC1G17DBV3 Reel of 3000 SOT (SOT-23) - DBV SN74LVC1G17DBVR SN74LVC1G17DBVRE4 SN74LVC1G17DBVRG4 -40C to 85C Tube of 250 C17 SN74LVC1G17DBVT SN74LVC1G17DBVTE4 SN74LVC1G17DCK3 Reel of 3000 SOT (SC-70) - DCK (1) (2) (3) 2 SN74LVC1G17DCKRE4 SN74LVC1G17DCKRG4 Tube of 250 SOT (SOT-553) - DRL SN74LVC1G17DCKR Reel of 4000 C7_ SN74LVC1G17DCKT SN74LVC1G17DCKTE4 SN74LVC1G17DRLR SN74LVC1G17DRLRG4 C7_ Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, *
1G17DSFR C7 C7 SN74LVC1G17DBV3 Reel of 3000 SOT (SOT-23) - DBV SN74LVC1G17DBVR SN74LVC1G17DBVRE4 SN74LVC1G17DBVRG4 -40C to 85C Tube of 250 C17 SN74LVC1G17DBVT SN74LVC1G17DBVTE4 SN74LVC1G17DCK3 Reel of 3000 SOT (SC-70) - DCK (1) (2) (3) 2 SN74LVC1G17DCKRE4 SN74LVC1G17DCKRG4 Tube of 250 SOT (SOT-553) - DRL SN74LVC1G17DCKR Reel of 4000 C7_ SN74LVC1G17DCKT SN74LVC1G17DCKTE4 SN74LVC1G17DRLR SN74LVC1G17DRLRG4 C7_ Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, *
1G17DSFR C7 C7 SN74LVC1G17DBV3 Reel of 3000 SOT (SOT-23) - DBV SN74LVC1G17DBVR SN74LVC1G17DBVRE4 SN74LVC1G17DBVRG4 -40C to 85C Tube of 250 C17 SN74LVC1G17DBVT SN74LVC1G17DBVTE4 SN74LVC1G17DCK3 Reel of 3000 SOT (SC-70) - DCK (1) (2) (3) 2 SN74LVC1G17DCKRE4 SN74LVC1G17DCKRG4 Tube of 250 SOT (SOT-553) - DRL SN74LVC1G17DCKR Reel of 4000 C7_ SN74LVC1G17DCKT SN74LVC1G17DCKTE4 SN74LVC1G17DRLR SN74LVC1G17DRLRG4 C7_ Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, *
SN74LVC1G17DBV3 Reel of 3000 SOT (SOT-23) - DBV SN74LVC1G17DBVR SN74LVC1G17DBVRE4 SN74LVC1G17DBVRG4 -40C to 85C Tube of 250 C17 SN74LVC1G17DBVT SN74LVC1G17DBVTE4 SN74LVC1G17DCK3 Reel of 3000 SOT (SC-70) - DCK SOT (SOT-553) - DRL (2) (3) SN74LVC1G17DCKRE4 SN74LVC1G17DCKRG4 Tube of 250 (1) SN74LVC1G17DCKR Reel of 4000 SN74LVC1G17DCKT SN74LVC1G17DCKTE4 SN74LVC1G17DRLR SN74LVC1G17DRLRG4 C7_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates sol
SN74LVC1G17DBV3 Reel of 3000 SOT (SOT-23) - DBV SN74LVC1G17DBVR SN74LVC1G17DBVRE4 SN74LVC1G17DBVRG4 -40C to 85C Tube of 250 C17 SN74LVC1G17DBVT SN74LVC1G17DBVTE4 SN74LVC1G17DCK3 Reel of 3000 SOT (SC-70) - DCK SOT (SOT-553) - DRL (2) (3) SN74LVC1G17DCKRE4 SN74LVC1G17DCKRG4 Tube of 250 (1) SN74LVC1G17DCKR Reel of 4000 SN74LVC1G17DCKT SN74LVC1G17DCKTE4 SN74LVC1G17DRLR SN74LVC1G17DRLRG4 C7_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates sol
SN74LVC1G17DBV3 Reel of 3000 SOT (SOT-23) - DBV SN74LVC1G17DBVR SN74LVC1G17DBVRE4 SN74LVC1G17DBVRG4 -40C to 85C Tube of 250 C17 SN74LVC1G17DBVT SN74LVC1G17DBVTE4 SN74LVC1G17DCK3 Reel of 3000 SOT (SC-70) - DCK SOT (SOT-553) - DRL (2) (3) SN74LVC1G17DCKRE4 SN74LVC1G17DCKRG4 Tube of 250 (1) SN74LVC1G17DCKR Reel of 4000 SN74LVC1G17DCKT SN74LVC1G17DCKTE4 SN74LVC1G17DRLR SN74LVC1G17DRLRG4 C7_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates sol
SN74LVC1G17DBV3 Reel of 3000 SOT (SOT-23) - DBV SN74LVC1G17DBVR SN74LVC1G17DBVRE4 SN74LVC1G17DBVRG4 -40C to 85C Tube of 250 C17 SN74LVC1G17DBVT SN74LVC1G17DBVTE4 SN74LVC1G17DCK3 Reel of 3000 SOT (SC-70) - DCK SOT (SOT-553) - DRL (2) (3) SN74LVC1G17DCKRE4 SN74LVC1G17DCKRG4 Tube of 250 (1) SN74LVC1G17DCKR Reel of 4000 SN74LVC1G17DCKT SN74LVC1G17DCKTE4 SN74LVC1G17DRLR SN74LVC1G17DRLRG4 C7_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates sol
SN74LVC1G17DBV3 Reel of 3000 SOT (SOT-23) - DBV SN74LVC1G17DBVR SN74LVC1G17DBVRE4 SN74LVC1G17DBVRG4 -40C to 85C Tube of 250 C17 SN74LVC1G17DBVT SN74LVC1G17DBVTE4 SN74LVC1G17DCK3 Reel of 3000 SOT (SC-70) - DCK SOT (SOT-553) - DRL (2) (3) SN74LVC1G17DCKRE4 SN74LVC1G17DCKRG4 Tube of 250 (1) SN74LVC1G17DCKR Reel of 4000 SN74LVC1G17DCKT SN74LVC1G17DCKTE4 SN74LVC1G17DRLR SN74LVC1G17DRLRG4 C7_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates sol
C7_ SN74LVC1G17DBV3 Reel of 3000 SOT (SOT-23) - DBV SN74LVC1G17DBVR SN74LVC1G17DBVRE4 SN74LVC1G17DBVRG4 -40C to 85C Tube of 250 C17 SN74LVC1G17DBVT SN74LVC1G17DBVTE4 SN74LVC1G17DCK3 Reel of 3000 SOT (SC-70) - DCK SOT (SOT-553) - DRL (2) SN74LVC1G17DCKRE4 SN74LVC1G17DCKRG4 Tube of 250 (1) SN74LVC1G17DCKR Reel of 4000 SN74LVC1G17DCKT SN74LVC1G17DCKTE4 SN74LVC1G17DRLR SN74LVC1G17DRLRG4 C7_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). YZV: The actual top-side marking is two lines. Line 1 has four characters to denote year, month, day, and assembly/te
SN74LVC1G17DBV3 Reel of 3000 SOT (SOT-23) - DBV SN74LVC1G17DBVR SN74LVC1G17DBVRE4 SN74LVC1G17DBVRG4 -40C to 85C Tube of 250 C17 SN74LVC1G17DBVT SN74LVC1G17DBVTE4 SN74LVC1G17DCK3 Reel of 3000 SOT (SC-70) - DCK SOT (SOT-553) - DRL (2) (3) SN74LVC1G17DCKRE4 SN74LVC1G17DCKRG4 Tube of 250 (1) SN74LVC1G17DCKR Reel of 4000 SN74LVC1G17DCKT SN74LVC1G17DCKTE4 SN74LVC1G17DRLR SN74LVC1G17DRLRG4 C7_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates sol
1G17DSFR C7 C7 SN74LVC1G17DBV3 Reel of 3000 SOT (SOT-23) - DBV SN74LVC1G17DBVR SN74LVC1G17DBVRE4 SN74LVC1G17DBVRG4 -40C to 85C Tube of 250 C17 SN74LVC1G17DBVT SN74LVC1G17DBVTE4 SN74LVC1G17DCK3 Reel of 3000 SOT (SC-70) - DCK (1) (2) (3) 2 SN74LVC1G17DCKRE4 SN74LVC1G17DCKRG4 Tube of 250 SOT (SOT-553) - DRL SN74LVC1G17DCKR Reel of 4000 C7_ SN74LVC1G17DCKT SN74LVC1G17DCKTE4 SN74LVC1G17DRLR SN74LVC1G17DRLRG4 C7_ Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, *