Product Datasheet Search Results:
366 Pages, 3651 KB, Original- DS34T108GN+
- Maxim
- IC TDM OVER PACKET 484HSBGA - DS34T108GN+
367 Pages, 4975 KB, Original- DS34T108GN+
- Maxim Integrated
- Communication ICs - Various Octal TDM Over Packet Chip
Product Details Search Results:
Maximintegrated.com/DS34T108GN+
{"Category":"Integrated Circuits (ICs)","Product Photos":"484-BGA Exp Pad","Family":"Specialized ICs","Series":"-","Package / Case":"484-BGA Exposed Pad","Supplier Device Package":"484-HSBGA (23x23)","Product Training Modules":"Lead (SnPb) Finish for COTS Long-Term Supply Program","Packaging":"Tray","Applications":"Data Transport","Datasheets":"DS34T101,102,104,108","Standard Package":"30","Mounting Type":"Surface Mount","Type":"TDM (Time Division Multiplexing)"}...
1452 Bytes - 21:45:59, 16 November 2024
Documentation and Support
Use our online request for specific proposed solutions or send your technical question directly to a product specialist at request:
| File Name | File Size (MB) | Document | MOQ | Support |
|---|---|---|---|---|
| LEYG32LDS3C-300-S5A1H.pdf | 43.95 | 1 | Request | |
| LEYG32LDS3C-30-S5A1H.pdf | 43.95 | 1 | Request | |
| LEY32DS3B-400-S2A2.pdf | 43.95 | 1 | Request | |
| LEY32DS3C-450B-R2A11.pdf | 43.95 | 1 | Request | |
| LEY32DS3A-100M-X5.pdf | 3.82 | 1 | Request | |
| CDQ2DS32TN-40DCZ-A93L.pdf | 14.85 | 1 | Request | |
| LEY32DS3B-500.pdf | 43.95 | 1 | Request | |
| LEYG32MDS3C-300B-R5A2H.pdf | 43.95 | 1 | Request | |
| LEYG32LDS3A-50-S5A1H.pdf | 43.95 | 1 | Request | |
| EH-XDS32.pdf | 1.18 | 1 | Request | |
| DS35-08A.pdf | 0.04 | 1 | Request | |
| DS35-12A.pdf | 0.04 | 1 | Request |
